Thin material, case inner pad, electronic components
This is an inner pad made of bonded thin sponge sheets. It can be manufactured even for thin items like cables of electronic components that do not have much thickness.
Thin material processing results in fewer edge irregularities and residual fibers compared to thick materials. Laminated bonding with double-sided tape is fundamental. The thickness of standard foam starts from 3mm or more.
- Company：フジカ工業
- Price：Other
